Vacuum Oven | Vacuum Drying Oven for Semiconductor Packaging and Laboratory Use

Vacuum Oven Precision Vacuum Drying and Heat Treatment Equipment

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Product Overview

The Vacuum Oven is engineered to perform drying and heat treatment of items under vacuum conditions. The equipment employs a vacuum pump to evacuate air and moisture, rapidly establishing a vacuum environment within the working chamber. This process effectively lowers the boiling point of moisture, significantly accelerates drying speed, and prevents oxidation, thermal damage, and dust contamination during heating.

This equipment is an ideal apparatus for scientific experiments in universities, research institutions, and enterprise laboratories. It is particularly suitable for vacuum moisture baking prior to encapsulation of semiconductor integrated circuits, semiconductor discrete devices, and hybrid integrated circuits.

Key Features

· Baking capability from ambient room temperature to 200°C

· Nitrogen atmosphere protection function for inert processing environments

· Integrated heating timing function

· Comprehensive alarm protection system with audible and visual alerts for over-temperature, thermocouple breakage, and other faults

· Programmable automatic control for precise, repeatable process cycles

Technical Specifications

Internal Workspace Dimensions 600 mm (Width) × 600 mm (Height) × 600 mm (Depth)

External Dimensions 880 mm (Width) × 1,690 mm (Height) × 820 mm (Depth)

Heating Area per Internal Layer/Shelf 600 mm (Width) × 600 mm (Depth) × 170 mm (Height)

Equipment Weight Approximately 400 kg

Applications

· Pre-encapsulation vacuum moisture baking for semiconductor integrated circuits, discrete devices, and hybrid integrated circuits

· Drying and heat treatment of moisture-sensitive or oxidation-prone materials in research and development laboratories

· Thermal processing under controlled vacuum or nitrogen inert atmospheres

· General scientific experiments and industrial drying applications requiring contamination-free, oxidation-resistant conditions

Advantages

By combining reliable vacuum technology with precise temperature control up to 200°C, nitrogen protection, and programmable operation, this Vacuum Oven delivers consistent, high-quality results while protecting sensitive components from oxidation and contamination. Its robust design and safety features make it a dependable choice for demanding laboratory and semiconductor support processes.



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